US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,591, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods for forming the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan) and Chia-Ping Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor die, a second semiconductor die including a side surface bonded to the first semiconductor die, such that the second semiconductor die is perpendicular to the first semiconductor die, and a junction circuit for connecting the first semiconductor...