US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Method for forming conductive bumps by performing a reflow process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,587, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming conductive bumps by performing a reflow process" was invented by Chao-Wei Chiu (Hsinchu City, Taiwan), Wei-Yu Chen (Taipei City, Taiwan), Chih-Chiang Tsao (Taoyuan City, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic apparatus including a package substrate and a structure disposed on and electrically connected to the package substrate through conductive bumps is provided. The material of the conductive...