US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Integrated circuit structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,344, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit structure and method of forming the same" was invented by Kam-Tou Sio (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Charles Chew-Yuen Young (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Yi-Hsun Chiu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an integrated circuit structure includes generating a first well layout pattern corresponding to fabricating a first well in the integrated circuit structure. The generating the first well la...