US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,543, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Ping-Yin Hsieh (Hsinchu, Taiwan), Chih-Hao Chen (Taipei City, Taiwan), Yi-Huan Liao (Hsinchu, Taiwan), Pu Wang (Hsinchu, Taiwan) and Li-Hui Cheng (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includ...