ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,574, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Bonding method" was invented by Jen-Yuan Chang (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes configuring a bonding tool based on a first semiconductor die and a second semiconductor die, wherein the bonding tool includes a platform and a first bonding head and a second bonding head connected to the platform; attaching the first semiconductor die to the first bonding head; moving the first semiconductor die toward a semiconductor wafer to bond the first semiconductor die to the semiconductor wafer; relea...