ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,754, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Zone-based CMP target control" was invented by Che-Liang Chung (Hsinchu, Taiwan), Che-Hao Tu (Hsinchu, Taiwan), Kei-Wei Chen (Hsinchu, Taiwan) and Chih-Wen Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to techniques of zone-based target control in chemical mechanical polishing of wafers. Multiple zones are identified on a surface of a wafer. The CMP target is achieved on each zone in a sequence of CMP processes. Each CMP process in the sequence achieves the CMP target for only one zone, usin...