US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Three-dimensional integrated circuit having ESD protection circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,723, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Three-dimensional integrated circuit having ESD protection circuit" was invented by Wei Yu Ma (Taitung City, Taiwan), Chia-Hui Chen (Hsinchu City, Taiwan) and Kuo-Ji Chen (Taipei County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit including: two or more substrates stacked one over another and including first and second substrates having a P-type doping, and third and fourth substrates having an N-type doping; the first substrate including a first dielectric isolation structure electrically separating the first s...