US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "System for thermal testing a wafer chuck and methods for performing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,461, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System for thermal testing a wafer chuck and methods for performing the same" was invented by Chia Wei Wang (Taipei City, Taiwan), Jian Cheng Chen (Hsinchu, Taiwan) and Huang Tang Peng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for testing a wafer chuck includes: a thermal test vehicle (TTV) that includes a substrate and thermal probes disposed on the substrate; and a vehicle controller configured to control heating of the substrate by the thermal probes and to store temperature data generated by the thermal probes."...