US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Stacked CMOS image sensor and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,730, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stacked CMOS image sensor and method of manufacturing the same" was invented by Chi-Hsien Chung (New Taipei City, Taiwan), Tzu-Jui Wang (Fengshan City, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan), Tzu-Hsuan Hsu (Kaohsiung City, Taiwan) and Dun-Nian Yaung (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a stacked complementary metal-oxide semiconductor (CMOS) image sensor with a high full well capacity (FWC). A first integrated circuit (IC) chip and a second IC chi...