US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Semiconductor photonics device and methods of formation for specific photonics construction and structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,595, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor photonics device and methods of formation for specific photonics construction and structure" was invented by Po-Chun Liu (Hsinchu City, Taiwan), Chih-Ming Chen (Hsinchu City, Taiwan) and Ru-Liang Lee (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor photonics device may include a photonic integrated circuit and may be coupled with an output optical fiber at a top surface of the semiconductor photonics device. To facilitate coupling of modulated optical signals to the output optical fiber at the top ...