US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,978, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package structure and method for forming the same" was invented by Chih-Hsuan Tai (Taipei City, Taiwan) and Hsiang-Tai Lu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes an interposer, an IPD package, a plurality of detecting bumps, and a plurality of daisy chains. The interposer includes at least a detecting pad and a plurality of bonding pads. The IPD package includes a plurality of metal bumps. The detecting bumps are disposed in the IPD package and separated fr...