US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,621, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and methods of forming the same" was invented by Wen-Ling Lu (Taoyuan, Taiwan), Yu-Chien Chiu (Hsinchu, Taiwan), Chih-Yu Chang (New Taipei, Taiwan), Hung-Wei Li (Hsinchu, Taiwan), Ya-Yun Cheng (Taichung, Taiwan), Zhiqiang Wu (Hsinchu, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan) and Mauricio Manfrini (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure provide a memory device and methods of forming the same. In one embodiment, a memory device is provided. The mem...