US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,998, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Hung-Pin Chang (New Taipei City, Taiwan), Der-Chyang Yeh (Hsin-Chu, Taiwan) and Wei-Cheng Wu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a forming method thereof are provided. The semiconductor device includes an integrated circuit (IC) die and an encapsulant. The IC die includes a semiconductor substrate and an interconnect structure connected to the semiconductor substrate, the semiconductor substrate includes a first ledge,...