US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Semiconductor contact structures and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,636, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor contact structures and methods" was invented by Huan-Chieh Su (Tianzhong Township, Taiwan), Cheng-Chi Chuang (New Taipei City, Taiwan), Chih-Hao Wang (Baoshan Township, Taiwan), Chun-Yuan Chen (Hsinchu, Taiwan), Sheng-Tsung Wang (Hsinchu, Taiwan) and Meng-Huan Jao (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a fin protruding from a substrate; forming a gate structure extending over the fin; forming a source/drain region in the fin adjacent the gate structure; forming a first isolatio...