US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,964, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Ping-Yin Hsieh (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei City, Taiwan), Pu Wang (Hsinchu City, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package structure includes: coupling a device package to a package substrate, where the device package includes semiconductor dies encapsulated by an insulating encapsulation and electrically coupled to the package substrate; forming a first dielectric pattern on the ...