US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Method of forming a memory cell having an offset interconnect via extending through a hard mask with variable thickness" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,624, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming a memory cell having an offset interconnect via extending through a hard mask with variable thickness" was invented by Fu-Chen Chang (New Taipei City, Taiwan), Tzu-Yu Chen (Kaohsiung City, Taiwan), Sheng-Hung Shih (Hsinchu City, Taiwan), Kuo-Chi Tu (Hsin-Chu, Taiwan), Wen-Ting Chu (Kaohsiung City, Taiwan) and Chih-Hsiang Chang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a lower insulating structure di...