ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,943, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Interconnect structures" was invented by Sung-Li Wang (Zhubei City, Taiwan) and Yasutoshi Okuno (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate generally to one or more methods for forming an interconnect structure, such as a dual damascene interconnect structure comprising a conductive line and a conductive via, and structures formed thereby. In some embodiments, an interconnect opening is formed through one or more dielectric layers over a semiconductor substrate. The interconnect opening has a...