US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Hybrid underfill structures for multi-die packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,020, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Hybrid underfill structures for multi-die packages and methods of forming the same" was invented by Wen-Yi Lin (New Taipei City, Taiwan), Kai-Cheng Chen (Taoyuan City, Taiwan), Chien-Li Kuo (Hsinchu City, Taiwan) and Chien-Chen Li (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment semiconductor package includes a package substrate, a first semiconductor die electrically and mechanically coupled to the package substrate, a second semiconductor die electrically and mechanically coupled to the package substrate, a non-condu...