US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Fluid collecting apparatus, cooling system and method of operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,571, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Fluid collecting apparatus, cooling system and method of operating the same" was invented by Kuo Yang Wu (Taoyuan City, Taiwan) and Shih-Ming Wang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fluid collecting apparatus includes a housing, a gripping member, an inlet, and an outlet. The housing includes a chamber. The gripping member is movable within the chamber, extendable toward or retractable away from a tank, and is configured to hold a computing device. The inlet is communicable with the chamber and configured to...