US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,493, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Yen-Ming Chen (Chu-Pei City, Taiwan) and Yung-Chi Lin (Su-Lin City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer on wafer on wafer and a chip on wafer on wafer structure and methods of forming the same are provided. In accordance with some embodiments, a first device wafer is bonded to a first carrier through wafer-on-wafer bonding and additional device wafers may subsequently be bonded to the first device wafer. A support wafer is then bonded to the top most device waf...