US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,496, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of forming the same" was invented by Hsi-Kuei Cheng (Zhubei, Taiwan), Ching Fu Chang (Taipei, Taiwan), Chih-Kang Han (Hsinchu, Taiwan) and Hsin-Chieh Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between ...