US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Trench isolation structure for scaled pixel region" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,355, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Trench isolation structure for scaled pixel region" was invented by Cheng Yu Huang (Hsinchu, Taiwan), Wei-Chieh Chiang (Yuanlin Township, Taiwan), Keng-Yu Chou (Kaohsiung City, Taiwan) and Tzu-Hsuan Hsu (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a first side and a second side opposing the first side. The substrate has one or more sidewalls defining a trench extending along...