US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,646, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming the same" was invented by Hao-Cheng Hou (Hsinchu, Taiwan), Tsung-Ding Wang (Tainan, Taiwan), Jung Wei Cheng (Hsinchu, Taiwan), Yu-Min Liang (Zhongli City, Taiwan), Chien-Hsun Lee (Chu-tung Town, Taiwan), Shang-Yun Hou (Jubei City, Taiwan), Wei-Yu Chen (Hsinchu, Taiwan), Collin Jordon Fleshman (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Shu-Rong Chun (Hsinchu, Taiwan) and Sheng-Chi Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a composite package subs...