US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor device including molded die stack and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,707, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device including molded die stack and methods of forming the same" was invented by Tsung-Fu Tsai (Changhua City, Taiwan), Chen-Hua Yu (Hsinchu City, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a bottom semiconductor die including a bottom semiconductor die sidewall, a top semiconductor die bonded to the bottom semiconductor die and including a top semiconductor die sidewall, and a molding material layer formed on an upper surface of the bottom semiconduct...