US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Reinforcement structures for chip-interposer and interposer-substrate bonding and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,627, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Reinforcement structures for chip-interposer and interposer-substrate bonding and methods of making the same" was invented by Yu Chen Lee (Hsinchu City, Taiwan), Chin-Hua Wang (New Taipei City, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment semiconductor package includes an interposer, a first semiconductor die electrically coupled to a first side of the interposer, and a first reinforcement structure that is mechanically coupled to the interposer and to the first semiconductor die, ...