US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,628, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure and method for forming the same" was invented by Tsung-Fu Tsai (Changhua City, Taiwan), Kung-Chen Yeh (Taichung City, Taiwan), I-Ting Huang (Kaohsiung City, Taiwan), Shih-Ting Lin (Taipei City, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a package structure is provided, which includes recessing a substrate to form a trench, disposing a first stacked die package structure over the substrate, forming an underfill layer over the first stacked die package struct...