US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,696, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Tsung-Yuan Yu (Taipei, Taiwan) and Tzuan-Horng Liu (Longtan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include a stacked semiconductor device and methods of forming the same. The stacked semiconductor device includes a first package embedded in a second package. Forming the first package includes mounting a first integrated circuit device to a first workpiece by a first set of solder connectors, depositing a first underfill between the fir...