US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Bond head with elastic material around perimeter to improve bonding quality" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,698, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Bond head with elastic material around perimeter to improve bonding quality" was invented by Chen-Hua Yu (Hsinchu City, Taiwan), Chih-Hang Tung (Hsinchu, Taiwan), Kuo-Chung Yee (Taoyuan City, Taiwan), Yian-Liang Kuo (Hsinchu City, Taiwan) and Jiun-Yi Wu (Zhongli City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a d...