US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Wafer backside cleaning apparatus and method of cleaning wafer backside" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,673,397, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer backside cleaning apparatus and method of cleaning wafer backside" was invented by Ching-Hai Yang (Taipei City, Taiwan), Yao-Hwan Kao (Hsinchu County, Taiwan) and Huang-Sheng Liu (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning and polishing pad includes a pad having a polishing surface, wherein the polishing surface includes a first material having a Shore D hardness ranging from 50 to 80 and a static coefficient of friction ranging from 0.01 to 0.6. The first material is a fluoropolymer. The pad in...