US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Method of making semiconductor device which includes Fins" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,672,946, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of making semiconductor device which includes Fins" was invented by Chih-Liang Chen (Hsinchu, Taiwan), Chih-Ming Lai (Hsinchu, Taiwan), Charles Chew-Yuen Young (Hsinchu, Taiwan), Chin-Yuan Tseng (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan), Kam-Tou Sio (Hsinchu, Taiwan), Ru-Gun Liu (Hsinchu, Taiwan), Wei-Liang Lin (Hsinchu, Taiwan) and L. C. Chou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method (of manufacturing fins for a semiconductor device) includes: forming semiconductor fins including ones thereof ha...