US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Wafer bonding method and bonded device structure" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,768, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer bonding method and bonded device structure" was invented by Harry-Haklay Chuang (Zhubei City, Taiwan), Yuan-Jen Lee (Hsinchu, Taiwan), Fang-Lan Chu (Taichung City, Taiwan), Wei Cheng Wu (Zhubei City, Taiwan) and Nuo Xu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a structure includes: a first device including a first dielectric layer and a first alignment mark in the first dielectric layer, the first alignment mark including a first magnetic cross, the first magnetic cross having a first north pole and a...