US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,792, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Xin Zhi Wang (Kaohsiung City, Taiwan) and Chuan-Ping Hou (Tainan Country, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor substrate, a metal gate structure disposed over the semiconductor substrate, an ILD structure over the semiconductor substrate and surrounding the metal gate structure, and a protecting layer over the ILD structure. A top surface of the protecting layer is aligned with a top surface of the metal ...