US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Integrated circuit structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,794, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit structure and manufacturing method thereof" was invented by Yung-Ching Chao (Yunlin County, Taiwan), Wei-Han Chiang (Hsinchu, Taiwan), Peng-Yuan Jung (Hsinchu, Taiwan), Chin-Wei Kang (Tainan City, Taiwan) and Cheng-Jen Lin (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a semiconductor substrate, a passivation layer, a first protective layer, and a second protective layer. The passivation layer is over the semiconductor substrate. The first protective layer is over ...