US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Energy harvest and storage device for semiconductor chips and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,549, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Energy harvest and storage device for semiconductor chips and methods for forming the same" was invented by Fu-Hai Li (Tainan City, Taiwan), Yi Ching Ong (Hsinchu, Taiwan) and Kuo-Ching Huang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure may include semiconductor devices located on a substrate, metal interconnect structures that are located within dielectric material layers overlying the semiconductor devices and are electrically connected to the semiconductor devices, and an energy harvesting devic...