US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Apparatus for processing substrates or wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,708, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus for processing substrates or wafers" was invented by Li-Chao Yin (Hsinchu, Taiwan), Yuling Chiu (Hsinchu, Taiwan), Yu-Lung Yang (Taichung City, Taiwan) and Hung-Bin Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vacuum apparatus includes process chambers, and a transfer chamber coupled to the process chambers. The transfer chamber includes one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted, and vent ports, from which a vent gas is supplied. The one or more vacuum ports and t...