US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Wrapper cell design and built-in self-test architecture for 3DIC test and diagnosis" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,578, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wrapper cell design and built-in self-test architecture for 3DIC test and diagnosis" was invented by Anshuman Chandra (Hsinchu, Taiwan) and Sandeep Kumar Goel (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods, and devices are described herein for performing intra-die and inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit includes a data register, an I/O pad, and a first multiplexer. The data register is configured to output a signal. The I/O pad is coupled to the data registe...