US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Semiconductor testing apparatus and method for testing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,574, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor testing apparatus and method for testing semiconductor structure" was invented by Ming-Hsuan Chang (Hsinchu City, Taiwan), Yuan-Li Lin (Taichung City, Taiwan), Sheng-Ming Yang (Kaohsiung City, Taiwan) and Kuo-Ming Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor testing apparatus is provided, and includes a base, a conductive socket, a pusher, and a thermal interface material structure. The conductive socket is disposed in the base for containing a semiconductor structure. The pusher is over...