US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Semiconductor structure and method manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,224, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method manufacturing the same" was invented by Meng-Pei Lu (Hsinchu City, Taiwan), Shin-Yi Yang (New Taipei City, Taiwan), Yun-Chi Chiang (Hsinchu City, Taiwan), Han-Tang Hung (Taipei City, Taiwan), Cian-Yu Chen (Taichung City, Taiwan) and Ming-Han Lee (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, at least one gate electrode, a plurality of source/drain (S/D) regions, a backside contact, a first dielectric layer, and a conductive via. The at least one...