US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Semiconductor device package and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,476, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device package and methods of formation" was invented by Ting-Ting Kuo (Hsinchu City, Taiwan), Li-Hsien Huang (Zhubei City, Taiwan), Tien-Chung Yang (Hsinchu City, Taiwan), Yao-Chun Chuang (Hsinchu City, Taiwan), Yinlung Lu (Hsinchu, Taiwan) and Jun He (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesion layer may be formed over portions of a redistribution layer (RDL) in a redistribution structure of a semiconductor device package. The portions of the RDL over which the adhesion layer is formed may be loca...