US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Semiconductor device including through via and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,446, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including through via and method of making" was invented by Chih-Yu Lai (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Chi-Yu Lu (Hsinchu, Taiwan) and Chung-Hsing Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate. The semiconductor device further includes a conductive mesh on a first side of the substrate. The semiconductor device further includes an active region on a second side of the substrate, wherein the first side of the substrate is opposite to t...