US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,465, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Cheng-Yu Kuo (Kaohsiung City, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chen-Hua Yu (Hsinchu City, Taiwan), Chung-Shi Liu (Hsinchu City, Taiwan), Yi-Yang Lei (Taichung City, Taiwan) and Wei-Jie Huang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulan...