US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Low resistance interconnect features and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,433, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Low resistance interconnect features and method for manufacturing the same" was invented by Chin-Lung Chung (Hsinchu, Taiwan), Shin-Yi Yang (Hsinchu, Taiwan), Yu-Chen Chan (Hsinchu, Taiwan), Han-Tang Hung (Hsinchu, Taiwan), Shu-Wei Li (Hsinchu, Taiwan) and Ming-Han Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the ...