US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Devices and methods for deposition" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,913, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Devices and methods for deposition" was invented by Yung-Chen Lin (Hsinchu, Taiwan), Wen-Bin Lai (Hsinchu, Taiwan) and Yi-Ping Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and methods for performing physical vapor deposition (PVD) include a process chamber. The process chamber includes a wafer holder, an annular shield with a vertical sidewall around a central opening, a clamp having a plurality of alignment pins extending from the lower surface and passing through the pin openings in the annular shield; and a h...