US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Apparatus for polishing a wafer" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,099, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Apparatus for polishing a wafer" was invented by Yu-Hsiang Chao (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for polishing a wafer is provided. The apparatus includes a wafer carrier assembly including a head body and a retainer arrangement. The retainer arrangement includes a first retainer segment coupled to an underside of the head body and adjacent an outer sidewall of the wafer carrier and a second retainer segment, separate from the first retainer segment, coupled to the underside of the head body and...