US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,130, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability" was invented by Yu-Teng Dai (New Taipei City, Taiwan), Chung-Ju Lee (Hsinchu City, Taiwan), Chih Wei Lu (Hsinchu City, Taiwan), Hsin-Chieh Yao (Hsinchu City, Taiwan), Hsi-Wen Tien (Xinfeng Township, Taiwan) and Wei-Hao Liao (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to an integrated chip including a plurality of conductive structures over a substrate. A first dielectric layer is disposed laterally between the co...