US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor wafer processing tool with improved leak check" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,071, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor wafer processing tool with improved leak check" was invented by Chih-Wei Chou (Taipei, Taiwan), Yuan-Hsin Chi (Taichung, Taiwan), Chih-Hao Yang (Hsinchu, Taiwan), Hung-Chih Wang (Taichung, Taiwan), Yu-Chi Liu (Taoyuan, Taiwan) and Sheng-Yuan Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A leak check is performed on a semiconductor wafer processing tool that includes a process chamber and process gas lines, and a semiconductor wafer is processed using the semiconductor wafer processing tool if the leak check ...