US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Interposer with planar sidewall surface for optical coupling and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,250, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer with planar sidewall surface for optical coupling and methods of forming the same" was invented by Tsung-Fu Tsai (Changhua City, Taiwan), Chao-Jen Wang (Hsinchu City, Taiwan), Szu-Wei Lu (Hsinchu City, Taiwan), Chung-Shi Liu (Hsinchu City, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device structure includes: an interposer including metal wiring structures and optical waveguides that are embedded in interlayer dielectric layers, wherein the interposer includes a stepped outer sidewall i...