US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,235, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same" was invented by Wei-Chieh Hsu (Hsinchu, Taiwan), Han-Hsiang Huang (Hsinchu, Taiwan), Yu-Sheng Lin (Zhubei City, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure includes a lower pad including a first conductive layer having a first diameter, and a second conductive layer on the first conductive layer and having...