US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 20 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,505, issued on Jan. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Huan-Chieh Su (Tianzhong Township, Taiwan), Zhi-Chang Lin (Zhubei, Taiwan), Li-Zhen Yu (New Taipei, Taiwan), Chun-Yuan Chen (Hsinchu, Taiwan), Lo-Heng Chang (Hsinchu, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan), Chih-Hao Wang (Baoshan Township, Taiwan) and Lin-Yu Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a first gate stack wrapping around first nanostructures, a second g...