US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Uniform trenches in semiconductor devices and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,852, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Uniform trenches in semiconductor devices and manufacturing method thereof" was invented by Ming Chyi Liu (Hsinchu, Taiwan), Jiech-Fun Lu (Tainan County, Taiwan) and Hung-Wen Hsu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor device having radiation-sensing regions separated by trench isolation structures. The semiconductor structure includes a first trench fill structure on a substrate and a second trench fill structure on the substrate. The first trench fill structure has a first w...